Speed, accuracy, high yield, and superior throughput are some of the benefits of Digicom's selective soldering process.
Before selective soldering begins the board is fluxed and preheated. A personalized time/temperature profile is calculated and true top-side preheat maintains the temperature of the board throughout the process. Through-hole components are soldered efficiently with repeatable high-quality solder joints. Digicom’s selective soldering system can solder any site, any orientation, anywhere on the board.