Solder Paste Printing
Solder paste not only performs the function of a physical interconnection material, but it is the structural support, thermal interface and conductor.
It is critical to the manufacturing process that the correct amount of solder is applied in exactly the right place.
Digicom has the latest in solder stencil printing equipment. We can accommodate a wide range of print formats. A laser-guided printer uses a scanning camera to quickly locate the fiducials and align the tooling and the PCBs accurately, while the transport system processes the boards with a minimum of handling time and the solder paste height detection system guarantees the correct height of the fillet. The easy-to-use touch screen makes programming faster and more precise.
The printer prints and inspects each pad and solder joint after the solder is applied, ensuring the accuracy and reliability of the printing. PCBs are inspected thoroughly for excess paste, missing paste, bridges, and other defects or anomalies.
Lead-free and tin-lead soldering options are available. Leaded components are processed through our state-of-the-art wave soldering system. For larger production runs we use a laser guided printer that uses a scanning camera to quickly locate the fiducials and align the tooling and the PCBs accurately.