services - Solder Reflow Oven
Digicom has a special oven for solder reflow.
A gold super mold module attached to the PCB board travels through the re-flow oven gathering data on thermal characteristics on a given printed board assembly. Six sensors are strategically attached to the various parts of the PCB board for various types of components; these are unique to a customer’s given design. Six independent channels record data from sensor readings at a maximum rate of 5,500 points per second.
Data from the module is transferred to the computer onboard. Complex algorithms and associated software, take into account sensors readings, characteristics of solder paste for use, and all other variables pertinent and unique to a particular assembly. A target profile is generated, and set points transferred to the oven configuration.
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| A unique time-temperature profile is generated for each board. |
Digicom's use of precision profiling allows the highest quality during the soldering process, since the tempature is controled precisely at each zone.
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